It also reduces growth time and allows for uniform layers across larger 8-inch wafers, making it ideal for commercial applications.Įmerging AI applications, like chatbots that generate natural human language, demand denser, more powerful computer chips. This technology bypasses previous challenges related to high temperatures and material transfer imperfections. Researchers from MIT have developed a low-temperature growth process to directly integrate 2D materials onto silicon chips, enabling denser and more powerful semiconductors. The new method involves growing layers of 2D transition metal dichalcogenide (TMD) materials directly on top of a silicon chip, a process that typically requires high temperatures that could damage the silicon.Ī new low-temperature growth and fabrication technology allows the integration of 2D materials directly onto a silicon circuit, which could lead to denser and more powerful chips. ![]() ![]() MIT researchers have innovated a low-temperature growth technology to integrate 2D materials onto a silicon circuit, paving the way for denser and more powerful chips.
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